Radial thermoelectric device assembly

ABSTRACT

According to some embodiments, a heat exchange device includes a housing, having at least one inlet, at least one first outlet and at least one second outlet. The device further includes an impeller positioned within the housing and configured to receive fluid from the at least one inlet and transfer it to at least one of the first outlet and the second outlet. In addition, the device comprises one or more heat exchange modules configured to receive a volume of fluid and selectively thermally condition it before said fluid exits through the first outlet or the second outlet. In one embodiment, the heat exchange module is partially or completely positioned within the housing.

CROSS REFERENCE TO RELATED APPLICATIONS

This application claims the priority benefit under 35 U.S.C. § 119(e) ofU.S. Provisional Application No. 60/951,431, filed Jul. 23, 2007, theentirety of which is hereby incorporated by reference herein.

BACKGROUND

1. Technical Field

This disclosure relates generally to temperature control devices, andmore particularly, to thermoelectric heat exchangers useful forproducing a heated and/or cooled fluid.

2. Description of the Related Art

U.S. Pat. No. 5,626,021 describes a temperature control system thatcomprises a thermoelectric unit and a blower, which can be used toprovide heated and/or cooled air to a surface of an automobile seat.Such a system can also be used to provide heated and/or cooled air to anenclosed space, bed, chair, other seating assembly and/or directly to auser.

With respect to automobile seats, in such arrangements, the heatedand/or cooled air can be distributed to the occupant by passing the airthrough one or more air ducts formed into the seat and then through theseat surface to the occupant. The amount of space available within,below, and around the seat for such temperature control systems is oftenseverely limited. For example, in some cars, to save weight or increasepassenger room, the seats are a few inches thick and abut the adjacentstructure of the car, such as the floorboard or the back of the car.Furthermore, automobile manufacturers are increasingly mounting variousdevices, such as electronic components or variable lumbar supports,within, below, and around the seat. Additionally, the size of the seat,particularly the seat back, is often designed to be as small as possibleto reduce the amount of cabin space consumed by the seat, therebyincreasing passenger space and/or decreasing weight.

Present temperature control systems can be too large to be mountedwithin, below or around vehicle seats. Conventional systems can have ablower five or six inches in diameter generating an air flow that passesthrough a duct to reach a heat exchanger that selectively adjusts thetemperature of the air. The heat exchanger can be several inches wideand long, and can be an inch or so thick. From the heat exchanger theair is transported through ducts to the bottom of the seat cushionand/or to the back of the seat cushion. Such systems are often bulky anddifficult to fit underneath or inside car seats.

The ducting used with these systems can also be bulky and difficult touse if the duct must go from a seat bottom to a seat back that isallowed to pivot or rotate. These ducts not only use additional spacewithin the seat, but also resist air flow and thus require a larger fanto provide the air flow. The larger fan can require additional space,may need to be operated at greater speeds and/or may generate morenoise. Noise is undesirable inside motor vehicles. Further, the ductingaffects the temperature of the passing air and either heats cool air, orcools heated air, with the result of often requiring larger fans or heatexchangers. In light of these drawbacks, there is a need for a morecompact and energy efficient heating and cooling system for automobileseats, and preferably a quieter system. In addition, a more compact andenergy-efficient heating and cooling system also has uses in otherlocalized conditioned air settings.

SUMMARY

According to some embodiments, a heat exchange device includes ahousing, having at least one inlet, at least one first outlet and atleast one second outlet. The device further includes an impellerpositioned within the housing and configured to receive fluid from theat least one inlet and transfer it to at least one of the first outletand the second outlet. In addition, the device comprises one or moreheat exchange modules configured to receive a volume of fluid andselectively thermally condition it before said fluid exits through thefirst outlet or the second outlet. In one embodiment, the heat exchangemodule is partially or completely positioned within the housing.

In some embodiments, the heat exchange module comprises a thermoelectricdevice. In other arrangements, the thermoelectric device comprises aPeltier circuit. In another embodiment, the heat exchange module furthercomprises heat exchangers that are in thermal communication with thethermoelectric device, such that at least a portion of the volume offluid is directed through or near such heat exchangers. In onearrangement, the heat exchangers are in thermal communication with asubstrate that includes a thermally conductive and electricallynon-conductive material.

In other arrangements, the heat exchange module is positioned along anouter perimeter portion of the interior of the housing. In anotherembodiment, the heat exchange module extends along substantially theentire perimeter portion of the housing. In still another arrangement,the device comprises at least two separate heat exchange modules. In oneembodiment, the heat exchange modules are substantially equally spacedapart within the interior of the housing. In other embodiments, the heatexchange modules are electrically connected to each other. In oneembodiment, the heat exchange modules are electrically connected to eachother using end couplings, said end coupling comprising extensions of asubstrate of a thermoelectric device.

According to some arrangements, the heat exchange module comprises a setof upper heat exchangers in fluid communication with an upper side ofthe thermoelectric device and a set of lower heat exchangers in fluidcommunication with a lower side of the thermoelectric device. In onearrangement, the at least one first outlet is in fluid communicationwith the set of upper heat exchangers and the at least one second outletis in fluid communication with the set of lower heat exchangers. Inanother arrangement, the at least first outlet is located along asidewall portion of the housing and wherein the at least second outletis located along a bottom portion of the housing.

In some embodiments, the impeller is configured to substantially deliveran equal volume of fluid to the at least first outlet and the at leastsecond outlet. In other arrangements, the heat exchangers are orientedalong a direction that generally coincides with a fluid flow directionapproaching said heat exchangers. In yet another embodiment, the deviceis configured to supply thermally conditioned fluid to a seat assembly,such as, for example, a vehicle seat, a bed, a sofa, a chair, awheelchair, a stadium seat and/or the like. According to someembodiments, the heat exchange module is configured to accommodatethermal stresses when in use. In one embodiment, a substrate of the heatexchange module comprises at least one expansion joint.

According to other arrangements, a climate controlled seat assemblycomprises a seat bottom portion, a seat back portion and a heat exchangedevice. The heat exchange device includes a housing, having at least oneinlet, at least one first outlet and at least one second outlet, animpeller positioned within the housing, the impeller configured toreceive fluid from the at least one inlet and transfer it to at leastone of the first outlet and the second outlet and at least one heatexchange module configured to receive a volume of fluid and selectivelythermally condition said fluid before said fluid exits through the firstoutlet or the second outlet. In some arrangements the heat exchangemodule is positioned within the housing. In other embodiments, thermallyconditioned fluid exiting the first outlet or the second outlet of theheat exchange device is configured to be delivered within an opening ofat least of the seat bottom portion and the seat back portion. Further,in some embodiments, thermally conditioned fluid is configured to betransferred toward a occupant of the seat assembly. In somearrangements, the heat exchange device is mounted to a surface of theseat back portion or the seat bottom portion. In another embodiment, atleast one of the first outlet and the second outlet is configured togenerally align with and be in fluid communication with the opening ofthe seat bottom portion or the seat back portion.

According to other embodiments, a method of thermally conditioning afluid includes positioning at least one heat exchange module within ahousing of a blower. The at least one heat exchange module is configuredto receive a volume of fluid and selectively thermally condition saidfluid before said fluid exits through an outlet of the housing. Themethod further comprises selectively heating or cooling said fluid byelectrically energizing said heat exchange module and activating animpeller of the blower. In some arrangements, the heat exchange modulecomprises a thermoelectric device.

U.S. Pat. No. 6,606,866 discloses various configurations of athermoelectric device (TED) with a radial heat exchanger andthermoelectric unit that are configured to address many of theshortcomings discussed above. While representing an improvement over theart, several aspects of the '866 design have limited its commercialapplication. For example, the radial thermoelectric modules disclosed inthe '866 module can be difficult to manufacture and may result infatigue damage caused by thermal expansion forces. In addition, the airflow through the radial heat exchangers may not be optimized forcommercial applications.

Some embodiments provide an annular heat exchanger system comprising aheat exchanger module system. The heat exchanger module systemcomprising: an inner perimeter defining an opening in the heat exchangermodule system; a thermoelectric device comprising: a first substratecomprising a plurality of sectors defining at least a portion of anouter perimeter of the thermoelectric device; a second substrate; and aplurality of thermoelectric pellets disposed between the first substrateand the second substrate.

Some embodiments provide a heat exchanger module system comprising: aplurality of heat exchanger modules defining at least a portion of anouter perimeter and an opening. Each heat exchanger module comprises: athermoelectric device comprising a first substrate, a second substrate,and a plurality to thermoelectric pellets disposed therebetween; a firstheat exchanger thermally coupled to the first substrate; and a secondheat exchanger thermally coupled to the second substrate.

Some embodiments provide a heat exchanger module system comprising: aplurality of heat exchanger modules, wherein each heat exchanger modulecomprises: a thermoelectric device comprising a first substrate, asecond substrate, and a plurality to thermoelectric pellets disposedtherebetween; a first heat exchanger thermally coupled to the firstsubstrate; and a second heat exchanger thermally coupled to the secondsubstrate; and a plurality of coupling members coupling at least someadjacent heat exchanger modules.

Some embodiments provide a method of manufacturing a heat exchangermodule system comprising: deforming coupling members of a heat exchangermodule system comprising: a plurality of heat exchanger modules disposedin a substantially linear array; and coupling members coupling adjacentheat exchanger modules to form a substantially polygonal heat exchangermodule system.

Some embodiments provide a method for conditioning a fluid, the methodcomprising: applying a potential to a thermoelectric device of a heatexchanger module, wherein the heat exchanger module comprises athermoelectric device comprising a first substrate, a second substrate,a plurality of thermoelectric pellets disposed therebetween, a firstheat exchanger thermally coupled to the first substrate, and a secondheat exchanger thermally coupled to the second substrate, and thepotential effectively generates a temperature differential between thefirst substrate and the second substrate; and flowing fluid throughfirst and second heat exchangers of a heat exchanger module system. Theheat exchanger module system comprises a plurality of heat exchangermodules defining at least a portion of a perimeter of the heat exchangermodule system and a perimeter of an opening, each module comprising anupper portion and a lower portion, and a first portion of the fluidflows radially from the perimeter of the opening through the upperportion of the heat exchanger module system and then radially out of thesystem and a second portion of the fluid flow flows radially from theperimeter of the opening through the lower portion of the heat exchangermodule system and then turns approximately 90 degrees and exits in anaxial direction.

Some embodiments provide a thermal module for delivering conditionedair, the module comprising: a housing comprising an upper portion, lowerportion and a side wall extending between the upper and lower portions,the housing defining an interior cavity and the upper portion defining,at least in part, an inlet into the interior cavity, the side walldefining, at least in part, a first outlet and the lower portiondefining, at least in part, a second outlet; an impeller positionedwithin the housing, the impeller comprising a plurality of bladesconfigured to rotate about a rotational axis and draw air into thehousing through the inlet and then direct the flow in a radial directiontowards the side wall; a thermoelectric heat exchanger system positionedwithin the housing. The thermoelectric heat exchanger system comprises:a first heat exchanger formed about the rotational axis of the impelleraxis and configured such that fluid flows along the first heat exchangerat least partially in a first direction; a second heat exchanger formedabout the rotational axis of the impeller and positioned below the firstheat exchanger and configured such that fluid flows along the secondheat exchanger at least partially in the first direction; and athermoelectric device having opposing surfaces that generate atemperature gradient between one surface and an opposing surface inresponse to electrical current flowing through the thermoelectricdevice, the one surface in thermal communication with the first heatexchanger and the opposing surface in thermal communication with thesecond heat exchanger, wherein a portion of the housing extends betweenan outlet of the first heat exchanger and an outlet of the second heatexchanger such that fluid from the first heat exchanger is directedtoward the first outlet and fluid from the second heat exchanger isdirected to the second outlet.

Some embodiments provide a radial outlet blower comprising a housingthat includes an upper portion, a lower portion and a side wallextending between the upper and lower portions. The housing generallydefines an interior cavity, and the upper portion generally defines, atleast in part, an inlet into the interior cavity. Further, the lowerportion defines, at least in part, a substantially circumferentiallyand/or radially symmetrical outlet. The radial outlet blower furtherincludes an impeller positioned within the housing, the impellercomprising a plurality of blades configured to rotate about a rotationalaxis and draw air into the housing through the inlet and then direct theflow in radial and/or axial direction towards one or more outlets.

These and other features are disclosed in further detail herein.

BRIEF DESCRIPTION OF THE DRAWINGS

These and other features, aspects and advantages of the present devices,systems and methods are described in detail below with reference todrawings of certain preferred embodiments, which are intended toillustrate, but not to limit, the present inventions. The drawingscontain seventy-six (76) figures. It is to be understood that theattached drawings are for the purpose of illustrating concepts of thepresent inventions and may not be to scale.

FIG. 1A is a perspective view from above of an embodiment of athermoelectric heat exchanger system.

FIG. 1B is a perspective view from below the thermoelectric heatexchanger system illustrated in FIG. 1A.

FIG. 1C is an exploded view of the thermoelectric heat exchanger systemillustrated in FIG. 1A.

FIG. 1D is a side cross section of the heat exchanger system FIG. 1A.

FIG. 1E is a perspective view of an embodiment of a heat exchangermodule.

FIG. 1F is a perspective view of the heat exchanger module of FIG. 1Emounted on an embodiment of a flow director.

FIG. 1G is a top view of a blower assembly comprising three heatexchanger modules according to one embodiment.

FIG. 1H is a top view of a blower assembly comprising two heat exchangermodules according to one embodiment.

FIG. 1I is a top view of a blower assembly comprising two heat exchangermodules according to another embodiment.

FIG. 2A is a top view of an embodiment of a polygonal heat exchangermodule system comprising a plurality of rectangular heat exchangers.

FIG. 2B is a top view of another embodiment of a polygonal heatexchanger module system comprising a plurality of rectangular heatexchangers.

FIG. 2C is a top view of another embodiment of a polygonal heatexchanger module system comprising a plurality of rectangular heatexchangers.

FIG. 2D illustrates a top view of a system comprising coupling membersuseful for coupling adjacent heat exchanger modules.

FIG. 2E illustrates a top view of adjacent heat exchanger modulesconnected to each other using coupling members according to oneembodiment.

FIG. 2F illustrates a side view of coupling members of adjacent heatexchanger modules being attached to one another using a spot weldaccording to one embodiment.

FIG. 2G illustrates a side view of coupling members of adjacent heatexchanger modules being positioned next to one another according to oneembodiment.

FIG. 2H illustrates the coupling members of FIG. 2G being spot welded toeach other using according to one embodiment.

FIG. 2I illustrates a top view of an assembly comprising flow blockingmembers positioned between adjacent heat exchanger modules according toone embodiment.

FIG. 3A illustrates a top view of an embodiment of a linear heatexchanger module system comprising deformable coupling members.

FIG. 3B illustrates the linear heat exchanger module system of FIG. 3Aconverted into a polygonal form.

FIGS. 3C and 3D are perspective views of an embodiment of a deformationof a coupling member in converting the linear embodiment of the heatexchanger module system illustrated in FIG. 3A into the polygonalembodiment illustrated in FIG. 3B.

FIG. 4A illustrates a top view of another embodiment of a detail linearheat exchanger module system comprising deformable coupling members.

FIGS. 4B and 4C are perspective views of an embodiment of a deformationof the coupling member of 4A.

FIG. 5A illustrates a top view of another embodiment of a detail linearheat exchanger module system comprising deformable coupling members.

FIGS. 5B and 5C are perspective views of an embodiment of a deformationof the coupling member of 5A.

FIG. 6A illustrates a top view of another embodiment of a detail linearheat exchanger module system comprising deformable coupling members.

FIGS. 6B and 6C are perspective views of an embodiment of a deformationof the coupling member of 6A.

FIG. 6D is a top view of a layout used in the manufacture of the heatexchanger module system of FIG. 6A.

FIG. 6E is a top view of a printed circuit board configured for use in ablower assembly comprising one or more heat exchanger modules accordingto one embodiment.

FIG. 7A illustrates in perspective an embodiment of an annular heatexchanger module suitable for use in a heat exchanger system.

FIGS. 7B-7D are a perspective and detail views of an embodiment of aheat exchanger useful in the heat exchanger module of FIG. 7A.

FIG. 7E is a cross-section view of an embodiment of the heat exchangermodule illustrated in FIG. 7A.

FIG. 7F is a cross-section view of the heat exchanger module of FIG. 7Eillustrating the effect of a temperature differential between first andsecond substrates thereof.

FIG. 7G is a top view of an embodiment of a thermoelectric device usedin the heat exchanger illustrated in FIG. 7A showing the effect of atemperature differential between first and second substrates thereof.

FIG. 7H illustrates a top view of an embodiment of a portion of asegmented substrate.

FIG. 8A is a top view of an embodiment of an annular thermoelectricdevice comprising a sectored first substrate and a non-sectored secondsubstrate.

FIG. 8B is a bottom view of an embodiment of an annular thermoelectricdevice comprising a sectored first substrate and a non-sectored secondsubstrate.

FIG. 9A is a top view of a sheet from which substrates of thethermoelectric devices are obtained according to one embodiment.

FIG. 9B is a top view of an embodiment of a thermoelectric device thatcomprises a plurality of arc-shaped substrate portions cut or otherwiseprovided from the sheet of FIG. 9A.

FIG. 9C is a top view of a sheet from which substrates of thethermoelectric devices are obtained according to another embodiment.

FIG. 9D is a top view of a sheet from which substrates of thethermoelectric devices are obtained according to still anotherembodiment.

FIG. 10 is a side cross-sectional view of an embodiment of a heatexchanger system in which first and second heat exchangers arepositioned lower compared with the embodiment illustrated in FIG. 1D,thereby equalizing the airflow through the first and second heatexchangers.

FIG. 11A is a top view of an embodiment of a heat exchanger systemcomprising fins or vanes for modifying the lateral distribution ofairflow through the first and second heat exchangers.

FIG. 11B is a top view of another embodiment of a heat exchanger systemcomprising fins or vanes for modifying the lateral distribution airflowthrough the first and second heat exchangers.

FIG. 11C illustrates a top view of one embodiment of air beingtransferred from an impeller toward a heat exchanger module positionedwithin an interior of a blower assembly.

FIG. 11D illustrates a detailed top view of the blower assembly of FIG.11C.

FIGS. 11E-11G illustrates top views of various embodiments of heatexchangers of a heat exchanger module positioned within a blowerassembly.

FIG. 11H illustrates a perspective view of a folded heat exchangeraccording to one embodiment.

FIGS. 11I and 11J illustrates top and side views, respectively, of afolded heat exchanger having a wave-like shape according to oneembodiment.

FIG. 12A is a cross section of an embodiment of a motor-impellerassembly in which the impeller comprises a vertical splitter plateconfigured to modify the relative airflow through first and second heatexchangers.

FIG. 12B is a top view of an embodiment of a motor-impeller assemblycomprising the vertical splitter plate of FIG. 12A.

FIGS. 13A and 13B are cross sections of another embodiment of amotor-impeller assembly in which the impeller comprises an angledsplitter plate configured to modify the relative airflow through firstand second heat exchangers.

FIGS. 14A and 14B illustrate in perspective and in a side cross-sectionan embodiment of the motor-impeller assembly comprising a top ring.

FIG. 14C is a cross-sectional view of a calculated airflow for a motormotor-impeller assembly as illustrated in FIGS. 14A and 14B.

FIG. 15 is a side cross sectional view of an embodiment of themotor-impeller assembly that does not comprise a top ring.

FIG. 16 illustrates embodiment of a motor-impeller assembly comprising adifferent number of upper blade portions and lower blade portions.

FIG. 17 a schematic illustration of a ventilation system that includesthermoelectric device in accordance with one embodiment.

FIG. 18A is a cross sectional view and FIG. 18B is a perspective of anembodiment of a radial outlet blower.

FIGS. 18C and 18D are a top view and a side view of an embodiment of aradial outlet blower mounted in a seat cushion.

FIG. 19A illustrates a blower in which the airflow outlet is turned 90°using a snout.

FIGS. 19B and 19C are a top view and a side view of the blowerillustrated in FIG. 19A mounted in a seat cushion.

FIG. 20 illustrates a side cross sectional view of an embodiment of aseating system comprising an embodiment of a radial outlet blower.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

Embodiments described below illustrate various configurations that maybe employed to achieve one or more improvements. The particularembodiments and examples are illustrative only and are not intended tolimit the concepts presented herein, and/or the various aspects and/orfeatures thereof. As used herein, the terms “cooling side,” “heatingside,” “cold side,” “hot side,” “cooler side,” “hotter side,” and thelike are relative terms and do not refer to any particular temperature.For example, the “hot,” “heating,” or “hotter” side of a thermoelectricelement or array may be at ambient temperature, with the “cold,”“cooling,” or “cooler” side at a temperature cooler than ambienttemperature. Conversely, the “cold,” “cooling,” or “cooler” side may beat ambient temperature with the “hot,” “heating” or “hotter” side at atemperature higher than ambient temperature. Thus, the terms arerelative to each other to indicate that one side of the thermoelectricis at a higher or lower temperature than the counter-designed side.

In addition, fluid flow is referenced in the discussion below as havingdirection. When such references are made, they generally refer to thedirection as depicted in the drawings. For example, fluid flow over orthrough a heat exchanger may be described as away from or along an axisabout which these heat exchangers are disposed. One skilled in the artwill understand that the fluid flow pattern in a device may take theform of a spiral, circular motion, another turbulent or laminar flowpattern and/or the like. The terminology indicating “away” from an axisor “along” an axis, or any other direction described in the applicationis meant to be an illustrative generalization of the direction withrespect to the drawings. Directional terms such as “top,” “bottom,”“upper,” “lower,” “left,” “right,” “front,” “back,” “clockwise,” and“counterclockwise” are also relative to the configuration illustrated inthe drawings.

FIG. 1A is a top perspective view of an embodiment of a generallydisk-shaped thermoelectric heat exchanger system 100. The illustratedthermoelectric heat exchanger system 100 comprises a flattenedcylindrical outer housing 110, which defines an interior cavity orchamber 111 (see FIG. 1D). The housing 110 generally comprises a topwall 112, a bottom wall 114 and a side wall 116. The top wall 112 andbottom wall 114 are generally flat and circular in the illustratedembodiment, and the side wall 116 is generally cylindrical. Thoseskilled in the art will understand that in other arrangements orembodiments the shape of the housing 110, top wall 112, bottom wall 114side wall 116 and/or any other portion of the system 100 can be modifiedas desired or required.

A generally circular intake or inlet 122 can be provided at or near thecenter of the top wall 112. In other embodiments, an intake can beformed in the bottom wall 114, either in addition to or instead of theillustrated intake 122. A first outlet 124 comprises one or moreopenings formed in a top or upper portion of the side wall 116. Further,a second outlet 126 (shown in FIG. 1B) comprises one or more openings126 formed around the periphery of the bottom wall 114. The intake 122,first outlet 124 and/or second outlet 126 may each extend into and maybe in fluid communication with an interior cavity of the housing 110.

With continued reference to FIG. 1A, a motor-impeller or fan assembly130 is disposed within the housing 110 and is visible through the intake122. As shown, a portion of a flow director or separator 140 can bisectand extend through the side wall 116. In the illustrated embodiment, theflow director 140 divides the housing 110 into an upper portion 110 athat comprises the top wall 112 and an upper portion of the sidewall116, and a lower portion 110 b that comprises a lower portion of thesidewall 116 and the bottom wall 114. The separator 140 is described ingreater detail herein.

FIG. 1B is a bottom perspective view of the thermoelectric heatexchanger system 100, showing the second outlet 126 formed in the bottomwall 114. In many applications, the first outlet 124 and/or secondoutlet 126 are in fluid communication with a ducting system that directsconditioned fluid provided by the thermoelectric heat exchanger system100 to and/or from one or more desired locations. Those skilled in theart will understand that other arrangements for the intake 122, firstoutlet 124 and second outlet 126 are used in other embodiments,depending on the particular application or use. For example, the shapeand location of the illustrated embodiments of the intake 122, firstoutlet 124 and/or second outlet 126 can be modified in other embodimentsas desired or required.

FIG. 1C is an exploded view of the thermoelectric heat exchanger system100 illustrated in FIGS. 1A and 1B. From top to bottom, FIG. 1Cillustrates the upper portion 110 a of the housing, a heat exchangermodule system 150 comprising a plurality of heat exchanger modules 152,the flow director 140, and the lower portion 110 b of the housing intowhich is mounted the motor-impeller assembly 130. In the illustratedembodiment, the heat exchanger module system 150 comprises a pluralityof heat exchanger modules 152 that are oriented in a polygonalarrangement, for example, as a regular hexagon. Such an arrangement isalso referred to herein as a “polygonal heat exchanger module system,”which is discussed in greater detail herein. As is explained in greaterdetail herein, it is anticipated that in modified embodiments, thepolygonal heat exchanger module system 150 can include more or fewerthan six heat exchanger modules 152. In addition, while in theillustrated embodiment the heat exchanger modules 152 are generallyrectangular with flat sides, it is anticipated that modified embodimentscan include heat exchanger modules 152 with sides that are not flat. Forexample, in one particular arrangement, the heat exchanger system 150comprises a plurality of arc-shaped segments that are arranged in agenerally circular pattern.

FIG. 1D is a cross-sectional view along the circumferential edge of athermoelectric heat exchanger system 100, which, because of thegenerally rotational symmetry of the device 100 around a central axis102, shows approximately only one half of the device 100. As discussed,the housing 110 can comprise a top portion 110 a and a bottom portion110 b. In the illustrated arrangement, a flow director 140 is disposedbetween the top 110 a and bottom 110 b portions of the housing. Themotor-impeller assembly 130 is centrally mounted to the bottom wall 114within the cavity 111 defined by the housing 110. The intake 122 iscentrally formed on the top wall 112. The heat exchanger module 152contacts the flow director 140, and extends between the top wall 112 andbottom wall 114 such that substantially all of the fluid flowing throughthe device 100 flows through one or more of the heat exchanger modules152 situated therein.

With continued reference to the embodiment illustrated in FIG. 1D, theheat exchanger module 152 comprises a first heat exchanger 154, a secondheat exchanger 156 and a thermoelectric device 160 generally positionedtherebetween. In some arrangements, the heat exchange modules 152, 154comprise fins (e.g., folded fins) or the like. The thermoelectric device160 is advantageously adapted to convert electrical energy into atemperature differential or gradient. One example of a suitablethermoelectric device 160 is a Peltier device, which comprises at leastone pair of dissimilar materials connected electrically in series andthermally in parallel, for example, a series of n-type and p-typesemiconductor pellets or elements. In some arrangements, a plurality ofthe semiconductor pellets are disposed between a first substrate 164 anda second substrate 166. Depending on the direction of current passingthrough the thermoelectric device 160, one of the first 164 or second166 substrates will be heated and the other will be cooled. Thesubstrates 164 and 166 typically comprise materials known in the artwith high thermal conductivity and low electrical conductivity, such as,for example, certain ceramic materials and/or polymer resins. In oneembodiment, the substrates 164, 166 comprise polyimide (e.g., filledpolyimide), epoxy and/or the like.

In the illustrated embodiments, the first heat exchanger 154 isthermally coupled to the first substrate 164 and the second heatexchanger 156 is thermally coupled to the second substrate 166. The heatexchangers are thermally coupled to the substrates by any suitablemeans. In one arrangement, the substrate comprises copper or othermetallic members secured to one on or both sides of a polyimide layer.Thus, the heat exchangers (e.g., fins) can be welded or otherwisefastened to an outer layer of copper or other metal included in thesubstrate. In other arrangements, the heat exchangers can be thermallycoupled to an adjacent substrate by disposing one or more thermalcompounds therebetween, such as, for example, thermal adhesive, thermalepoxy, thermal grease, thermal paste, and/or other thermal compoundsknown in the art. In embodiments using a thermal adhesive and/or thermalepoxy, the thermal compound can also serve to mechanically secure theheat exchanger to the substrate. In some embodiments, the heatexchangers are secured to the substrates using mechanical fastenersknown in the art. The heat exchangers 154 and 156 typically comprisethermally conductive materials formed in a high surface-area geometry,for example, as fins, blades, pins, channels and/or the like, thatpermits radial fluid flow.

As discussed in greater detail herein, in some embodiments, the first154 and second 156 heat exchangers are radially segmented (e.g., in thedirection of fluid flow, in a direction generally perpendicular to thedirection of flow and/or in any other direction). Segmenting a heatexchanger can help increase the efficiency of the heat transfer from theheat exchanger to a fluid by thermally isolating adjacent segments fromeach other. In addition, segmentation of the heat exchangers and/or thesubstrate can help reduce the thermal stresses to the system when air orother fluid is being heated or cooled by the thermoelectric device. Inother embodiments, the first 154 and second 156 heat exchangers can beformed without radial segmentation or with partial radial segmentation.

In the illustrated embodiment, the flow director 140 or divider contactsand extends radially from the thermoelectric device 160, which togetherwith the top wall 112 and upper portion of the side wall 116, define afirst chamber 118 around the periphery of the top of the cavity 111.Similarly, the flow director 140, thermoelectric device 160, bottom wall114 and lower portion of the side wall 116 define a second chamber 119around the periphery of the bottom of the cavity. Because heated fluidwill flow through one of the first 118 and second 119 chambers andcooled fluid will flow through the other, in some embodiments, the flowdirector 140 comprises a thermally insulating material known in the art.Examples of suitable thermally insulating materials comprise one or morepolymer resins, for example, polyurethane, polyvinyl chloride,polypropylene, polyethylene, polyolefin,acrylonitrile-butadiene-styrene, acrylic, polyamide, polyester,polyimide, polysulfone, polyurea, polycarbonate, and copolymers, blends,and mixtures thereof. In some embodiments, the thermally insulatingmaterial is expanded, for example, using a blowing agent, which improvesthe insulation value of the material. Some embodiments of the flowdirector 140 comprise a composite material, which provides, for example,both the desired insulating properties as well as the desired mechanicalproperties. For example, in some embodiments, a composite is formedcomprising one or more polymer materials, and one or more fiberreinforcing materials known in the art (e.g., fiber glass, carbon fiber,boron fiber, etc.). In preferred embodiments, substantially no fluidflows between the first chamber 118 and the second chamber 119. Thefirst outlet 124 can place the first chamber 118 in fluid communicationwith a first exterior portion of the device 100, while the second outlet126 can place the second chamber 119 in fluid communication with asecond exterior portion of the device 100.

As shown in the embodiment of a heat exchanger module 152 illustrated inFIG. 1E, the first heat exchanger 154 and second heat exchanger 156 canbe longer (radially) than the thermoelectric device, thereby forming aslot 158. With reference now to FIG. 1F, in the illustrated arrangement,at least a portion of the flow director 140 is dimensioned andconfigured to be received in the slot 158 generally formed between theheat exchangers 154, 156. Accordingly, in some embodiments, the flowdirector 140 and vertical dimension of the slot 158 of thethermoelectric device 160 have substantially the same thickness. In theillustrated embodiment, the flow director 140 comprises a plurality ofengagement members 142 dimensioned to engage and secure each heatexchanger module 152 laterally (i.e., at their respective ends), therebyreducing lateral movement thereof.

With continued reference to FIG. 1D, the motor-impeller assembly 130 caninclude a plurality of fan blades 132 secured to a motor rotor 134.Details of electrical circuitry current paths and terminals that powerthe thermoelectric device 160 and the motor-impeller assembly 130 areomitted for clarity.

In use, a fluid, for example, air, is drawn into the thermoelectric heatexchanger system 100 through the intake 122 by the motor-impellerassembly 130, which compresses or otherwise exerts energy on the fluid.Consequently, the air or other fluid can be expelled radially into thechamber 111 within the housing 110. A first portion of fluid is forcedthrough the first heat exchanger 154, which, for example, cools thefirst portion of fluid. The cooled first portion of fluid then entersthe first chamber 118 and exits the device through the first outlet 124(e.g., waste outlet). Likewise, a second portion of fluid is forcedthrough the second heat exchanger 156, which in this example, heats thesecond portion of fluid. The second portion of fluid enters the secondchamber 119 and exits the device 100 through the second outlet 126(e.g., main outlet). In the illustrated embodiment, the first and secondheat exchangers 154, 156 and the first and second chambers 118, 119 areall positioned within the housing 110 and thus part of the cavity 111defined by the housing 110.

Arrows in FIG. 1D indicate the general fluid flow through the heatexchanger system 100. With reference to these arrows, in the illustratedarrangement, the fluid enters the system 100 in a first direction A thatis generally parallel or substantially parallel to the rotational axisof the motor-impeller assembly 130 and perpendicular to the disc-shapedhousing 110. The fluid is then turned approximately 90 degrees such thatit is directed in a substantially radial direction B with respect to therotational axis of the motor-impeller assembly 130. The flow continuesin this radial direction through the first and the second heatexchangers 154, 156. In the illustrated arrangement, the flow throughthe first heat exchanger 154 continues radially through the first outlet124 and out of the housing 110. In the illustrated embodiment, the flowthrough the second heat exchanger 156 continues and is turned about 90degrees by the side wall 116 and exits through the second outlet 126 andout of the housing 110 in a direction that is generally perpendicular tothe radial direction B and parallel to the rotational axis of themotor-impeller assembly 130. Those skilled in the art will understandthat in modified embodiments the first outlet 124 and/or the secondoutlet 126 can be independently configured to discharge fluid radially,tangentially, axially or in any intermediate direction.

In one embodiment, the first heat exchanger 154 comprises the “wasteside” of the heat exchanger system 100. That is, the flow of the airthrough the second heat exchanger 156 can be directed to a surface of aseating assembly (e.g., vehicle seat, bed, etc.) that is to be cooledand/or heated by the heat exchanger system 100. Depending whether theair through the second heat exchanger is to be heated or cooled, heat iseither removed from or transferred to the air flowing through the firstheat exchanger 152. In modified embodiments, the system 100 can bereversed, with the second heat exchanger 156 operating as the “wasteside” of the heat exchanger system 100. For example, such a reversal inheating and cooling modes can be accomplished by changing the directionof the current being delivered to the Peltier circuit or otherthermoelectric device.

According to some embodiments, as illustrated in FIGS. 1G-1I anddiscussed in greater detail herein, a heat exchanger module system caninclude one or more heat exchange systems (e.g., thermoelectric devices,heat exchangers, etc.) that are not positioned around the entireperiphery of system. For example, in the arrangement illustrated in FIG.1G, the system comprises a total of three heat exchange systems 150′that are oriented (e.g., at equally or substantially equally spacedintervals, such as 120 degree increments) around a center impeller 130′.In other embodiments, the quantity, size, shape, spacing, locationand/or other details of the heat exchange systems 150′ can vary, asdesired or required. In some embodiments, the heat exchange systems 150′are electrically connected to each other (e.g., the pellets areelectrically connected in series to one another). However, in otherarrangements, the heat exchange systems 150′ are powered and controlledseparately of each other.

Intermittently spaced heat exchange systems 150′, as illustrated inFIGS. 1G-1I, function in a similar manner as those that include a heatexchange system around the entire or most of the system (e.g., FIGS. 1C,2A, etc.). Air is directed to one or more of the heat exchange systems150′ for thermal conditioning. As discussed, a portion of the air exitsthe system through a main outlet while the remainder of the air exitsthe system through a waste outlet. The housing of the system can includeopenings that are intermittently located. For example, in oneembodiment, the openings (e.g., outlets, exits, etc.) generally coincidewith the location, size, space and/or other characteristics of the heatexchange systems 150′.

The system depicted in FIG. 1H is similar to the embodiment illustratedin FIG. 1G and discussed herein. However, as shown, the illustratedsystem includes only two heat exchange systems 150″ that are positionedgenerally on opposite ends of the impeller 130″. In FIGS. 1G and 1H, theheat exchange systems include a curved shape to generally match thecontoured shape of the housing, the impeller and/or one or more othercomponents or features of the system. However, as illustrated in FIG.1I, the heat exchange systems 150′″ can include a generally rectangularshape or any other shape.

The embodiments illustrated in FIGS. 1G-1I can help reduce manufacturingcosts of such assemblies as the size and complexity of the heat exchangemodules (e.g., the quantity of components, amount of materials needed,etc.) is reduced. Such a configuration can also help provide additionalpackaging flexibility to an assembly.

FIG. 2A illustrates a top view of a modified embodiment of a polygonalheat exchanger module system 2200 that can be used in a heat exchangersystem 100 as described herein. In contrast to the embodimentillustrated described above, the embodiment of FIG. 2A comprises a setof eight heat exchanger modules 2210, each of which form at least aportion of a side of the polygon. Collectively, the heat exchangermodules 2210 form at least a portion of a perimeter of the polygonalheat exchanger module system 2200. An opening 2240 in the heat exchangermodule system 2200 is shaped, dimensioned and otherwise configured toreceive, for example, a motor-impeller assembly, as discussed above. Inthe illustrated embodiment, the heat exchanger modules 2210 also defineat least a portion of the perimeter of the opening 2240. The illustratedembodiment is generally symmetrical about a central axis 2250, forming aregular polygon (e.g., an octagon). Those skilled in the art willunderstand that other embodiments may not be rotationally symmetrical.

In the illustrated embodiment, adjacent heat exchanger modules 2210generally abut each other, thereby forming a closed figure with smallgaps or without any gaps at all. Such a configuration can help directfluid through the heat exchanger module system 2200. As discussed, theillustrated heat exchanger module system 2200 is suitable for use, forexample, in the heat exchanger system illustrated in FIGS. 1A-1F. Eachheat exchanger module 2210 can comprise first and second (notillustrated) heat exchangers that are thermally coupled to oppositefaces of a thermoelectric device 2216. In some embodiments, the area ofthe thermoelectric device 2216 is not coextensive with the areas of thefirst 2212 and second (not illustrated) heat exchangers. For example, inthe illustrated embodiment, the thermoelectric device 2216 is narrowerthan the first 2212 and second heat exchangers, as indicated by theshading. Thus, the heat exchanger module system 2200 is configured topermit fluid flow from the opening 2240 inside the polygon to outsidethe polygon through the heat exchangers thermally coupled to thethermoelectric devices. As discussed, this can allow such air or otherfluid to be selectively heated or cooled, as desired.

In the illustrated embodiment, each heat exchanger module 2210 isgenerally rectangular or linear as viewed from the top, in contrast tothe curved heat exchanger modules discussed below. Embodiments ofsystems incorporating rectangular heat exchanger modules can provide oneor more of the following advantages: ease of manufacture of thethermoelectric device 2216 and/or heat exchanger module 2210; reducedcost; interchangeability; replaceability; design flexibility; and thelike. For example, although the illustrated embodiment comprises heatexchanger modules 2210 substantially of generally equal dimensions,other embodiments comprise heat exchanger modules with at least twodifferent dimensions.

In other embodiments, a heat exchanger module system comprises aplurality of thermoelectric devices defining a least a portion of aperimeter of a polygon, and first and second heat exchangers thermallycoupled thereto. At least one of the first and second heat exchangersspans adjacent thermoelectric devices. For example, some embodimentscomprise unitary annular heat exchangers of the type illustrated inFIGS. 7A and 7B that are sized, shaped and otherwise configured toextend along some or all of the heat exchanger modules (e.g.,thermoelectric devices, substrates, etc.) included within a particularhousing, such as those illustrated in FIGS. 2A-2C. Accordingly, theadvantages of a polygonal array of thermoelectric devices with the heattransfer advantages of unitary, annular heat exchangers, can becombined, as discussed in greater detail herein.

FIG. 2B illustrates a top view of another embodiment of a heat exchangermodule system 2200 which is similar to the embodiment illustrated inFIG. 2A. However, as shown, the embodiment depicted in FIG. 2B includesa total of six heat exchanger modules 2210. The embodiment of a heatexchanger module system 2200 illustrated in a top view in FIG. 2C issimilar to the embodiment illustrated in FIG. 2B except that itcomprises gaps 2202 between adjacent heat exchanger modules 2210. Insome embodiments, the gaps 2202 improve the manufacturability of theheat exchanger module system 2200. For example, such gaps can permitwider dimensional tolerances for one or more of the individualcomponents. The gaps 2202 can also permit relative motion of the heatexchanger modules 2210 and/or components thereof, for example, thermalexpansion and contraction, mechanical motion and/or the like. Gapsbetween heat exchanger modules can be filled, for example, using asuitably configured flow director and/or using separate filler strips,thereby preventing fluid from bypassing the heat exchanger modulesystem. Other embodiments do not comprise gaps between every adjacentpair of heat exchanger modules. It will be appreciated that inembodiments that comprise gaps between adjacent heat exchanger modules,the size of such gaps can vary as desired or required by a particularapplication.

FIG. 2D illustrates a portion of an embodiment of a system 2200 forcoupling adjacent heat exchanger modules 2210, mechanically and/orelectrically. In the illustrated embodiment, each heat exchanger module2210 comprises a coupling member 2230 in the form of an interconnect tabat each end that is dimensioned and configured to couple one or morecomponents (e.g., substrates, heat exchangers, etc.) and/or portions ofadjacent heat exchanger modules 2210, mechanically and/or electrically.For example, the substrates of adjacent heat exchanger modules 2210 canbe electrically coupled to each other to advantageously transmit anelectrical current throughout the pellets of two or more adjacentthermoelectric devices. The coupling members 2230 are coupled by anymethod known in the art, for example, using plugs, sockets, quickconnects, clips, solder joints, welds, screws, swages, rivets,adhesives, combinations thereof and/or the like. As discussed, one ormore portions or components of adjacent heat exchange modules (e.g.,thermoelectric devices, substrates, fins or other heat exchangers, etc.)can be joined to each other using one or more attachment methods ordevices. In some embodiments, the modules are electrically and/orthermally connected to each other to simplify the design of the system.

As illustrated in FIG. 2E, adjacent heat exchange modules can beattached to each other along coupling members 2230′ or another portionthat extends along the edges of the modules. In some embodiments, thecoupling members 2230′ are generally rectangular tab members that areshaped, sized and otherwise configured to overlap with coupling members2230′ of adjacent heat exchange modules. In some arrangements, thecoupling members 2230′ comprise a metal layer or strip or anotherconductive member that is configured to place the thermoelectric devicesof the adjacent modules in electrical communication with one another. Asa result, a current supplied to one module can be advantageouslytransmitted to one or more other modules within a particular system.

FIG. 2F illustrates a side view of adjacent coupling members 2230′ beingspot welded to each other. As shown, spot welding electrodes E+, E− canbe positioned along opposite ends of the coupling members 2230′. Once asufficient force has been applied to urge the coupling members 2230′into contact with one another, a current can be passed from oneelectrode E+ to the other electrode E−. This process can result in aspot weld 2268 being formed at or near a location where the couplingmembers 2230′ are in contact with one another.

In some embodiments, the coupling members 2230′ are simply an extensionof the upper and/or lower substrate of the thermoelectric device. Asdiscussed, such a substrate preferably includes a thermally conductiveand electrically insulating layer, such as, for example, polyimide,ceramic and/or the like. As a result, the extension of such anelectrically non-conductive layer into the coupling members 2230′ canmake it additionally difficult to spot weld the coupling members 2230′to each other, as there must a conductive path for the electricalcurrent to pass from one electrode E+ to the other electrode E−, throughthe coupling members 2230′. Consequently, the electricallynon-conductive layer or portion (e.g., polyimide, ceramic, etc.) of thesubstrate may need to be removed, penetrated or otherwise compromisedbefore the spot welding process can be completed.

FIG. 2G illustrates a side view of two coupling members 2230′ that areessentially a continuation of the substrates 2264 (e.g., upper or lower)of the thermoelectric devices in the adjacent heat exchange modules. Asshown, each coupling member 2230′ includes a metal (e.g., copper) layer2266 that is configured to contact or be adjacent to a metal layer 2266of the adjacent coupling member 2230′. In addition, the opposite sidesof the substrate 2264 include a layer of polyimide 2265, ceramic or someother electrically non-conductive material. Thus, as discussed, thislayer of electrically non-conductive material 2265 may need to beremoved, sliced, punctured or otherwise compromised before a spot weld2268 can be formed between the coupling members 2230′.

According to one embodiment, a spot weld 2268 can be formed betweenadjacent coupling members 2230′ without compromising the electricallynon-conductive layer 2265 is illustrated in FIG. 2H. As shown,electrodes E+, E− may be positioned along the metal layers 2266 of eachcoupling member 2230′ in locations that are not horizontally alignedwith each other. Consequently, for stability, there may be a need toapply counteracting or balancing forces B opposite of each electrode E+,E−. In addition, pinching or squeezing forces F may be applied along theportion of the coupling members 2230′ where the spot weld 2268 isdesired to ensure proper contact between the metal layers or member2266. As shown, electrical current can be routed through the metal layeror member 2266 along a less direct route than normally conducted whenspot welding (e.g., FIG. 2F). Nevertheless, this spot welding method mayallow an adequate spot weld 2268 to be formed between the couplingmembers 2230′ without the need to remove polyimide or anotherelectrically non-conductive layer therefrom. It will be appreciated thatsuch a spot welding technique can be applied to other fields of usebesides connecting adjacent heat exchange modules of a heat exchangersystem.

FIG. 2I illustrates a top view of a plurality of heat exchanger modules150 positioned within a heat exchange assembly. As discussed, themodules 150 can be oriented in such a way that creates gaps 188 betweenadjacent heat exchangers (e.g., fins) that are in thermal communicationwith thermoelectric devices. In order to ensure that air or other fluidbeing moved by the blower does not bypass or short-circuit the heatexchangers of the modules 150, flow-blocking tabs 190 or other memberscan be strategically positioned at one or more such gaps 188. In someembodiments, the tabs 190 are attached to the housing (e.g., the upperplate, the lower plate, the sidewalls, etc.). However, in otherembodiments, the tabs 190 or other flow-blocking members are attached tothe modules 150 and/or another portion of the assembly.

FIG. 3A illustrates a top view of an embodiment of a heat exchangermodule system 2300 comprising a plurality of heat exchanger modules 2310and a plurality of coupling members 2360 coupling adjacent heatexchanger modules 2310. A terminal coupling member 2370 extends fromeach terminal heat exchanger module 2310 a. Embodiments of the system2300 are useful, for example, for fabricating a heat exchanger modulesystem similar to that illustrated in FIG. 2A. Each heat exchangermodule 2310 is substantially as described above, comprising athermoelectric device and first and second heat exchangers.

With continued reference to FIG. 3A, an edge of each of the heatexchanger modules 2310, an edge of each of the coupling members 2360 andan edge of each of the terminal coupling members 2370 can besubstantially collinear. The illustrated embodiment is, for example, theconfiguration of the device 2300 as manufactured. However, those skilledin the art will understand that different arrangements can be used inother embodiments. In the illustrated embodiment, the coupling members2360 mechanically and electrically couple adjacent heat exchangermodules 2310, and the terminal coupling members 2370 are mechanicallyand electrically coupled to the terminal heat exchanger modules 2310 a.In some arrangements, at least a portion of each coupling member 2360 isflexible, bendable and/or deformable, as will be described in greaterdetail below.

FIG. 3B illustrates a top view of a conversion of the heat exchangermodule system 2300 from the linear configuration illustrated in FIG. 3A(in phantom), into a polygonal (e.g., hexagonal in the illustratedembodiment) configuration. In the illustrated embodiment, the conversionis effected by bending or deforming the coupling members 2360 to providethe desired configuration. In the illustrated embodiment, the terminalcoupling members 2370 are proximal in the final configuration.

FIGS. 3C and 3D are perspective views of a possible folding of thecoupling members 2360 to reconfigure the device 2300 from the linearform illustrated in FIG. 2300A to the closed form such as the oneillustrated in FIG. 3B.

FIG. 4A illustrates a top view of a detail of another embodiment of acoupling member 2460 and adjacent heat exchanger modules 2410 suitablefor fabricating a heat exchanger module system of the type generallyillustrated in FIG. 2A. FIGS. 4B and 4C illustrate suitable foldings ordeformations of the coupling member 2460. As best seen in FIG. 4B,portions 2462 of the coupling member 2460 can be positioned downstreamof the heat exchanger module 2410, and consequently, be configured topartially or completely block airflow therefrom.

FIG. 5A illustrates a top view of a detail of another embodiment of acoupling member 2560 and adjacent heat exchanger modules 2510 suitablefor fabricating a heat exchanger module system of the type illustratedin FIG. 2A. FIGS. 5B and 5C illustrate suitable foldings or deformationsof the coupling member 2560.

FIG. 6A illustrates a top view of a detail of another embodiment of acoupling member 2660 and adjacent heat exchanger modules 2610 suitablefor fabricating a heat exchanger module system of the type illustratedin FIG. 2A. FIGS. 6B and 6C illustrate suitable foldings or deformationsof the coupling member 2660. In the folded configurations illustrated inFIGS. 5A and 6A, because no portion of the coupling member 2560, 2660 ispositioned downstream of a heat exchanger module 2510, 2610, airflowblockage is not a problem.

Furthermore, as best seen in FIG. 6A, the coupling member 2660 can beformed entirely within the envelope of the heat exchanger modules 2610(e.g., that is, within the bounds of the width of the heat exchangermodules). Consequently, in embodiments in which at least a portion ofthe coupling member 2660 is formed integrally with at least a portion ofthe heat exchanger module 2610, for example, with the substrate or otherportion or component of the thermoelectric device, the illustratedembodiment can be manufactured with reduced waste compared withembodiments in which the coupling member extends beyond the envelope ofthe heat exchanger module, for example, the embodiments illustrated inFIGS. 4A-4C and 5A-5C. An exemplary layout of two heat exchanger modules2610 is illustrated in FIG. 6D, showing such an efficient layout.Accordingly, embodiments of the heat exchanger module system illustratedin FIGS. 6A-6C can be more efficient, easier and/or less expensive tomanufacture.

FIG. 6E illustrates one embodiment of a printed circuit board (PCB) 180or other electrical bus that can be used to facilitate attaching one ormore heat exchanger modules 150 thereto. As shown, the PCB 180 or otherbase member can include a plurality of slits 182 or other connectionpoints onto which ends 151 of a module 150 can be mounted. The slits 182can be configured to permit the ends 151 of a module 150 to be placed inelectrical communication with one another (e.g., in a seriesconfiguration) using a main electrical strip 181 or conductive memberthat advantageously is exposed at each slit 182. As a result, one ormore modules 150 (e.g., thermoelectric devices, fins or other heatexchangers, etc.) can be easily secured to the PCB 180 or similar base.For example, the modules 150 can include end terminals 151 that can besoldered to the PCB 180 at the slits 182 or other connection points.This permits a user to conveniently customize a particular assembly bychoosing the quantity, type and other details regarding the heatexchanger modules 150. Further, the simple connection to the PCBeliminates the need for more complicated, labor intensive and expensiveelectrical connections between adjacent modules 150. It will beappreciated that a PCB or other electrical bus member can beincorporated into any of the embodiments illustrated and/or describedherein, or equivalents thereof.

The embodiments illustrated in FIGS. 4-6 are also useful in heatexchanger systems comprising a plurality of thermoelectric devicesdefining a perimeter of a polygon thermally coupled to first and secondheat exchangers, at least a portion of which spans a plurality ofthermoelectric devices, for example, a heat exchanger similar to theembodiment illustrated in FIG. 7B, which is discussed below.

FIG. 7A illustrates a perspective view of an embodiment of a heatexchanger module 1900 suitable for use in a heat exchanger system, forexample, the systems described and/or illustrated herein (e.g., FIG. 1,9, etc.). The illustrated heat exchanger module 1900 comprises athermoelectric device 1910, a first heat exchanger 1920 disposed on anupper surface of the thermoelectric device 1910 and a second heatexchanger 1930 disposed on a lower surface of the thermoelectric device1910. In the illustrated embodiment, the thermoelectric device 1910 isin the form of a thin, ring-shaped or annular disk defined by minor (R1)radius forming a perimeter of an opening 1940 and major (R2) radiusforming a perimeter of the heat exchanger module 1900. In someembodiments, the opening 1940 is dimensioned and configured to receive amotor-impeller assembly, for example, as described above and illustratedin FIG. 1D. In the illustrated embodiment, each of the heat exchangers1920 and 1930 is substantially ring-shaped, with similar orsubstantially similar heights (H), and with similar or substantiallysimilar minor (R1) and major (R2) radii as the thermoelectric device1910. However, in other arrangements, the relative heights (H), theminor and/or major radii and/or any other property of the module may bevaried as desired or required.

In the embodiment illustrated in FIG. 7A, the heat exchangers 1920 and1930 are manufactured by pleating or fan-folding one or more thermallyconductive materials to form a plurality of fins 1922, as illustrated inFIGS. 7B-7D. Those skilled in the art will understand that otherembodiments may use different fan-fold geometries. As depicted in FIGS.7C and 7D, which are detailed views of the heat exchanger 1920 shown inFIG. 7B, the fins 1922 are closer together at the minor radius R1 andspread farther apart in the radial direction to a maximum spacing at themajor radius R2. Accordingly, the fin density is highest at the centerof the heat exchangers 1920 and 1930, which in the illustratedarrangement is upstream in the fluid flow, and lowest at the outer edge,which is downstream in the fluid flow.

In some arrangements, heat transfer for a fluid flow through a pipe maydepend on two variables of interest: the heat transfer coefficient, h,and the heat transfer surface area, A. It is generally known that theheat transfer coefficient h is highest at the pipe inlet, here theupstream end of the heat exchanger at R1. The surface area A is alsohighest at R1 because the fin density is highest there. Both of theseeffects combine to provide improved heat exchange in heat exchangerswith higher fin densities at the inlet and lower fin densities at theoutlet, which is achieved in the illustrated embodiment by bending ordeforming a putative rectangular heat exchanger around an axis normal tothe top and bottom of the heat exchanger to modify the fin spacing. Inthe illustrated embodiment, the deformation is circular, resulting in aring-shaped heat exchanger. Those skilled in the art will understandthat the same result is achieved using other deformations in otherembodiments, for example deformation into an arc shape.

FIG. 7E illustrates a cross section of the heat exchanger module 1900along section E-E of FIG. 7A. The thermoelectric device 1910 comprises afirst substrate 1912, a second substrate 1914 and a plurality ofsemiconductor pellets 1916 disposed therebetween. The semiconductorpellets 1916 are of any type known in the art for converting electricalenergy into a temperature gradient. The substrates 1912 and 1914typically comprise materials with high thermal conductivity and lowelectrical conductivity known in the art, as discussed above.

The first heat exchanger 1920 is secured to the first substrate 1912(e.g., a copper or other metal layer disposed on the substrate) and thesecond heat exchanger 1930 is similarly secured to the second substrate1914. As discussed, the heat exchangers 1920 and 1930 are typicallysecured to the substrates 1912 and 1914, respectively, in a manner thatprovides a suitable thermal conductivity therebetween, while ensuringthat the two portions will remain adequately connected to one anotherduring use.

In use, one of the first substrate 1912 and second substrate 1914 warms(hot), while the other cools (cold) when a voltage is applied across thepellets. For materials with normal (positive) coefficients of thermalexpansion, the hot substrate expands, and the cold substrate contracts,as illustrated in FIG. 7F, in which the first substrate 1912 is the hotsubstrate and the second substrate 1914 is the cold substrate. Thisdifferential expansion of the substrates 1912 and 1914 produces shearand bending moments and stresses at the pellets 1906, which can lead tomechanical failure of the thermoelectric device 1910. The physicaldeformation of the thermoelectric device 1910 can also affect fluiddynamics in the heat exchanger system, thereby reducing efficiency ofthe system. The magnitudes of the shear and bending forces and stressesmay depend on the coefficient(s) of thermal expansion of the substrates1912 and 1914, the temperature differential (ΔT=Th−Tc), the size (e.g.,length, width, thickness, etc.) of the substrates 1912 and 1914 (L)and/or one or more other factors.

FIG. 7G illustrates a top view of the thermoelectric device 1910depicted in FIG. 7A during use, showing the expansion of the firstsubstrate 1912 and the contraction of the second substrate 1914. Theeffective length L for this device 1910 is the outer diameter (2R2) ofthe entire thermoelectric device 1910, rather than the differencebetween the major and minor radii (R2−R1), which is smaller. Such alarger effective dimension may result in relatively large shear andbending forces in the illustrated embodiment.

FIGS. 8A and 8B illustrate top and bottom views, respectively, of anannular thermoelectric device 2010 that reduces at least some of thedetrimental effects of the differential expansion, while retaining theadvantage of increased heat transfer from curved or ring-shaped heatexchangers. The thermoelectric device 2010 is similar to thethermoelectric device 1910 illustrated in FIGS. 7A-7F, with a generallycircular shape, and is suitable for similar applications, for example,as a component of a thermoelectric heat exchanger module as illustratedin FIG. 7A and/or in the thermoelectric heat exchanger systemillustrated in FIG. 1. The depicted thermoelectric device 2010 comprisesfirst and second substrates 2012 and 2014, respectively, and a pluralityof pellets (not illustrated) disposed therebetween. A generally circularopening 2040 is provided, for example, to receive a motor-impellerassembly as discussed above. In the illustrated embodiment, the secondsubstrate 2014 and the pellets are generally as described above for thethermoelectric device 1910. The first substrate 2012, however, comprisesa plurality of sectors or pieces 2012 a. In the illustrated embodiment,the sectors 2012 a are substantially rotationally symmetrical around acentral axis 2050. Accordingly, each of the seven sectors 2012 a has agenerally similar size. Those skilled in the art will understand thatother embodiments comprise unequally sized sectors, and/or other more orfewer sectors. Because the sectors 2012 a of the first substrate arefree to move individually rather than as a single unit, the relevantlength L in evaluating the shear and bending forces induced by atemperature differential between the first 2012 and second 2014substrates is the radial width of each sector 2012 a (R2−R1) and/or thecircumferential width W of each sector 2012 a, whichever is larger,rather than the diameter of the substrate 2010 (2R2). Because R2−R1 isless than 2R2, and in some embodiments, significantly less, the shearand bending forces and stresses can be advantageously reduced. Inessence, dividing the first substrate 2012 into sectors 2012 a provides“expansion joints” 2013 therefor. It will be appreciated that asubstrate can comprise such expansion joints 2013 or gaps in the radialand/or circumferential direction, as desired or required.

In the illustrated embodiment, the sectors 2012 a are generallyarc-shaped, or truncated wedges, corresponding to the single-piece firstsubstrate 1912 (FIG. 7G) with a plurality of generally radial cuts,thereby resulting in a plurality of laterally or circumferentiallyseparated sectors that define at least a portion of the perimeter of thefirst substrate 1912. In the illustrated embodiment, the sectors 2012 a,define both the perimeter of the first substrate 2012 (R1) as well asthe perimeter of the opening 2040 (R2). In some embodiments, an annularfirst heat exchanger similar to the embodiment illustrated in FIG. 7B isthermally coupled to the first substrate 2010. Other embodiments use amulticomponent heat exchanger, for example, each component correspondingto a sector 2012 a. In other arrangements, a single heat exchanger canextend, partially or completely, over two or more different sectors 2012a of a substrate having expansion joints. The sectored substrate 2012 isdistinct from the segmented heat exchangers described above inconnection with the embodiment illustrated in FIG. 1D, which aregenerally radially rather than laterally separated. Some embodiments ofa heat exchanger module or system comprising the sectored substrate 2012also comprise one or more radially segmented heat exchangers, whichprovide thermal isolation between the segments in the direction of flowand improved thermal performance.

FIG. 7H is a top view of an embodiment of a portion of a first substrate2010, which is divided into sectors 2010 a both laterally and radially,thereby even further reducing mechanical stress that arises from atemperature differential between the first and second substrates of thethermoelectric device. Accordingly, by segmenting the substrates in acircumferential direction stress can be reduced in the circumferentialdirection during heating and/or cooling. In addition, segmentation inthe radial direction can also reduce stress if there is a large radialdimension in the device. In addition, radial segmentation can alsoprovide for thermal isolation that can result in more efficient heattransfer. For additional details regarding the reduction of thermalstresses imposed during the use of a thermoelectric device, please referto U.S. Patent Application No. 60/951,432, filed Jul. 23, 2007 and thenon-provisional application (application serial number unknown), filedon Jul. 23, 2008 and titled SEGMENTED THERMOELECTRIC DEVICE, whichclaims the priority benefit under 35 U.S.C. § 119(e) of U.S. PatentApplication No. 60/951,432, the entireties of which are herebyincorporated by reference herein.

FIG. 9A illustrates a top view of a sheet 2109A of a thermallyconductive, electrically non-conductive material which may be cut orotherwise shaped to supply the upper and/or lower substrates of anannular thermoelectric device 2110 similar to the embodiment illustratedin FIGS. 8A and 8B. The sheet 2109A or other member from which thesubstrate for the thermoelectric device 2110 is obtained can comprise arelatively large rectangular shape. As illustrated in FIG. 9A, inembodiments where the thermoelectric device 2110 includes a generallycurved shape, the substrate can comprise a plurality of arc-shapedmember. This may be the case when one of the substrates (e.g., upper orlower) of the thermoelectric device includes radial expansion joints tohelp relieve thermal stresses during use, as discussed in greater detailherein. Thus, the first substrate 2112 may be divided into sectors 2112a similar to the first substrate 2012 of the embodiment illustrated inFIG. 8A.

With continued reference to FIG. 9A, the use of such arc-shapedsubstrates can help increase the “packing efficiency” of the substratesheet from which the individual substrate portions are extracted. Inother words, the amount of material of the sheet 2109A that is wasted(e.g., not capable of being used to cut out or otherwise be used toprovide a portion of a substrate) can be advantageously reduced. Thiscan lower the manufacturing and/or assembly cost for such devices,especially where the relative cost of the substrate material isrelatively high. In contrast, one of skill in the art will appreciatethat the amount of “wasted” sheet material would be significantly higherif a single annular substrate (FIG. 8B) was used in lieu of a pluralityof segmented arc-shaped portions.

Heat exchanger modules fabricated from the thermoelectric device 2110further comprise a first heat exchanger thermally coupled to the firstsubstrate 2112 and a second heat exchanger thermally coupled to thesecond substrate 2114, as described above. In some embodiments, thefirst and second heat exchangers substantially correspond in shape tothe arc-shaped thermoelectric device subunits 2110 a, thereby formingarc-shaped heat exchanger submodules. Alternatively, each of thearc-shaped heat exchanger units can be viewed as an individual heatexchanger module, and the assembly of the individual heat exchangermodules viewed as forming a heat exchanger module assembly or system.

In other embodiments, the boundaries of at least one of the first andsecond heat exchangers does not substantially correspond to one of theboundaries to at least one of the arc-shaped thermoelectric devicesubunits 2110 a. For example, in some embodiments, each of the first andsecond heat exchangers comprise a unitary heat exchanger, for example,as illustrated in FIG. 7B. In some embodiments, at least one of thefirst and second substrate of the thermoelectric device comprisessectors that are divided radially, essentially forming concentricthermoelectric devices in some embodiments. A detailed description ofsuch an arrangement can be found in U.S. Pat. No. 6,539,725, theentirety of which is hereby incorporated by reference herein.

FIG. 9B illustrates a top view of an embodiment of a thermoelectricdevice 2110 in which a plurality of substrate portions 2110 a, in theillustrated embodiment, three thermoelectric device subunits, are nestedin a radial direction. As discussed, when compared to a single circularor donut shaped substrate, the use of a plurality of arc-shapedsubstrates 2110 a may help reduce manufacturing costs by reducing waste.Specifically, the arc-shaped substrate portions may be cut next to eachother in a stacked or nested arrangement to reduce waste between cutoutsas shown in FIG. 9B. In contrast, the use of circular or donut-shapedthermoelectric devices may result in a larger amount of wasted substratematerial (e.g., polyimide with copper or other metal portions on one orboth of its surfaces) as the hole of the substrate is wasted when theannular or donut-shaped substrate portions are cut or stamped out of asheet or other member 2109C (see FIG. 9C).

With reference to FIG. 9D, it will be appreciated that the use ofrectangular substrate portions can further reduce the amount of wastematerial produced when the sheet 2109D of thermally conductive materialis being cut or otherwise processed. As shown, in some embodiments, theuse of rectangular substrates can help minimize the amount of wastedsubstrate material, as the sheet 2109D can simply be cut along aplurality of horizontal and vertical lines. One embodiment of a devicethat comprises a plurality of rectangular thermoelectric devices 2112Dthat would be configured to use such rectangular substrate portions inillustrated in FIG. 9D.

As was described herein with reference to FIG. 1D, the air from thefirst heat exchanger 154 (e.g., waste air) can be directed in a radialdirection while the air from the second heat exchanger 156 (e.g., mainair) can be directed in a direction that is parallel to the rotationalaxis of the motor-impeller assembly 130. In addition to the differentexit directions, the flow from the motor-impeller may be biased to thelower side of the cavity 111. This can result in uneven flow betweenheat exchangers 154, 156. In general, it is desirable to have equal orapproximately equal amount of air delivered to both heat exchangers 154,156.

FIG. 10 illustrates a modified heat exchanger system 300. In thedepicted embodiment, the upper and lower housing portions 302, 304 andthe separator 306 are configured such that the first and second heatexchangers 154, 156 are positioned lower than the embodiments of FIGS.1A-1D described above. Accordingly, the air exiting the motor-impellerassembly 130 moves in a radial and downward direction before enteringthe first and second heat exchangers 154, 156. This arrangement pushesmore air through the first heat exchanger 154 compensating for the biasof air to the lower portions of the cavity 111.

FIG. 1A illustrates additional embodiments in which flow-conditioning orflow-directing fins or vanes 320 can be positioned upstream and/ordownstream of the first and second exchangers 154, 156. These vanes canbe used to provide for lateral distribution of air flow through theoutlet of the device. In some embodiments, the fins or vanes 320 areconfigured to provide equal or substantially equal flow to thethermoelectric devices. In other embodiments, such fins or vanes 320 areused to achieve a desired flow pattern.

FIG. 11B illustrates an embodiment in which the outlet 126 of the secondheat exchanger 156 is provided with fins or vanes 322 that can beselectively used to restrict flow and thus bias flow though the firstheat exchanger 154. It will be appreciated that one or more otherdevices or methods can be used to distribute and/or condition air as itis directed radially away from the impeller toward one or morethermoelectric devices and/or outlets.

As discussed, the air or other fluid displaced by an impeller may not bedirected in a direction that allows easy fluid entry into the fins orother heat exchangers. Thus, as illustrated in FIGS. 11C and 11D, theheat exchanger system 150C can be configured to better receive the airdirected toward it by the impeller 130C. With reference to the detailedtop view of FIG. 11D, adjacent fins 156C or other heat exchangers can beoriented in such a way as to facilitate entry of fluid therethrough. Forexample, the fins 156C can be skewed relative to radial direction by aparticular angle θ₂ that is generally adapted to match or substantiallymatch the anticipated airflow direction A. As a result, fluidhead-losses through the system can be advantageously reduced. Further,such features can help reduce noise, improve the efficiency of thesystem and provide one or more other advantages.

FIGS. 11E-11G illustrates various other embodiments of heat exchangersystems 150E, 150F, 150G that are configured to better accommodate airor other fluid as it approaches the leading end of these systems. Forexample, as with the arrangement illustrated in FIG. 1 ID, the threeembodiments depicted in FIGS. 11E-11G comprise fins 156E, 156F, 156Gwith leading ends that are curved according to the anticipated directionof the airflow A leaving the impeller.

As shown in FIG. 11E, the tail ends of the fins 156E or other heatexchangers can also be curved (e.g., either in the same direction as theleading ends or in the opposite direction). Further, the tail ends ofthe fins 156F can be non-curved (e.g., generally aligned with the radialdirection) as illustrated in FIG. 11F. In addition, as shown in FIG.11G, the fins 156G or other heat exchangers can have any other shape orconfiguration to permit the air entering and passing therethrough to bedirected in a desired manner.

FIG. 11H illustrates a perspective view of folded fins 156H configuredto be used with any of the embodiments disclosed herein. As discussed,such fins or other heat exchangers can be placed in thermalcommunication with one or more thermoelectric devices or substrates. Aparticular assembly can include one, two or more sets of such fins 156H,as desired or required. As discussed, a unitary structure of such heatexchangers can be placed on the top or the bottom of one, two or moreheat exchanger modules.

FIGS. 11I and 11J illustrate top and side view, respectively, of anotherembodiment of folded heat exchangers 156I (e.g., fins). As shown, thefins 156I can include a curved or fluted shape. For example, asdiscussed, such a configuration can facilitate the entry of air or otherfluid therethrough. It will be appreciated that heat exchangers caninclude one or more other shapes, designs or configurations, as desiredor required.

FIG. 12A illustrates another arrangement for biasing flow between thefirst and second heat exchanger 154, 156. In this embodiment, themotor-impeller assembly 130 comprises a horizontal splitter plate 138that divides the blades of the impeller 130 into an upper portion 132 awith a height L1 and a lower portion 132 b with a height L2, whereL2>L1. By increasing the relative depth or other dimension of either theupper portion 132 a or lower portion 132 b, air can be biased to eitherthe first or second heat exchanger 154, 156, as desired or required by aparticular application or use. As compared to the embodiment of FIG. 10,this embodiment advantageously can maintain the generally flat profileof the top surface of the system (i.e., the top wall 302 of FIG. 10 caninclude a step).

FIG. 12B illustrates a top view of an embodiment of a motor-impellerassembly 130 comprising the horizontal splitter plate 138 illustrated inFIG. 12A. A plurality of spokes 136 extending from the motor rotor 134to the splitter plate 138/blade 132 a, 132 b assembly may permit fluiddrawn in through the intake or inlet 122 (FIG. 1D) to flow to the lowerportion 132 b of the blades. Those skilled in the art will understandthat other means for providing fluid to the lower portion 132 b of theblades can be used in other embodiments, either in lieu of or inaddition to the devices and methods specifically disclosed herein. Forexample, one or more fluid intakes in the bottom wall 114 (FIG. 1D) canbe provided.

FIG. 13A illustrates a modified embodiment of the arrangement of FIG.12. In this embodiment, the splitter plate 138 can be angled upwardly ordownwardly at an angle θ from the radial direction in order to provide asmooth transition as the air is turned towards either the first orsecond heat exchangers. This can reduce and/or eliminate turbulencecaused as the air contacts the splitter plate 138. FIG. 13B is adetailed view of the region around the splitter plate 138 in which therelative fluid flow is generally indicated by arrows. In someembodiments, the splitter plate 138 can also include a curved orotherwise shaped profile to further reduce turbulence as desired orrequired by a particular application or use.

FIGS. 14A and 14B illustrate an embodiment of the motor-impellerassembly 130 comprising a top ring 139 in a perspective view and in aside cross-sectional view, respectively. In some embodiments, the topring 139 reduces airflow through the upper heat exchanger that is influid communication with the upper chamber 118, as shown in FIG. 14C,which is a cross-sectional view of a computational fluid dynamics (CFD)model of a motor motor-impeller assembly 130 comprising a top ring 139.It is believed that turbulence from the top ring 139 may be responsiblefor the reduced airflow through the upper heat exchanger, which resultsin an unbalanced airflow between the first and second heat exchangers.

Accordingly, some embodiments of the motor-impeller assembly 130 do notcomprise a top ring, an embodiment of which is illustrated in FIG. 15 ina side cross sectional view. Some embodiments of the motor-impellerassembly 130 provide improved airflow through the upper heat exchangercompared with similar motor-impeller assemblies comprising a top ring,thereby resulting in a more balanced airflow between the first andsecond heat exchangers.

FIG. 16 illustrates a side view of another embodiment of amotor-impeller assembly 130 that permits control over the relativeairflow through the first and second heat exchangers. As shown, themotor-impeller assembly 130 can comprise a vertical splitter plate 138that generally divides the blades into an upper portion 132 a and alower portion 132 b, similar to the embodiments illustrated in FIGS.12A, 13A, and 13B. In the illustrated embodiment, the relative airflowis modified by varying the number of upper portions 132 a and/or lowerportions 132 b of the blades. For example, the illustrated embodimentcomprises 50 upper blade portions 132 a, 80 lower blade portions 132 b.Those skilled in the art will understand that other embodiments comprisea different number of upper blade portions 132 a and lower bladeportions 132 b, as desired or required. Further, the number of upperblade portions 132 a can be greater than the number of lower bladeportions 132 b. Factors affecting the number of upper blade portions 132a and lower blade portions 132 b in a particular application mayinclude, but are not limited to, the specific geometry (e.g., shape,size, etc.) of the motor-impeller assembly 130 and overall device, thecharacteristics of the heat exchangers and/or the like. In someembodiments, such factors are determined by modeling, for example, byCFD, by using one or more empirical methods and/or the like.

As discussed herein, some embodiments are useful in providingconditioned air to vehicle seats, beds, furnishings, wheelchairs, otherstationary or mobile seating assemblies or other devices and/or thelike, but are not limited to such uses. The method and apparatus isuseful anywhere a localized flow of conditioned air is desired. In somearrangements, such fluid transfer systems and devices adapted toselectively thermally condition air or other fluids can be directedtoward one or more users either directly (e.g., spot heating or cooling)or through a fluid distribution system of a seat assembly or otherdevice. FIG. 17 illustrates one embodiment in which heat exchangesystems 100, as described herein, are used in combination with aventilated vehicle seat 10. Such systems 100 can be controlledseparately through dedicated controllers 12 or through a main controlunit (not shown).

Embodiments of the systems, devices, and methods described herein arenot limited to conditioning air and/or other gases or fluids. Somegases, for example helium, have greater thermal conductivity than airand are desirable in certain applications, while other gases such asoxygen, nitrogen and/or argon are desirable in other applications. Avariety of gases and gas mixtures can be used depending on theparticular application.

Some embodiments are useful in heating or cooling other fluids, forexample, liquids and/or supercritical fluids through the use ofappropriate seals, insulators, and/or other components known in the art,thereby preventing such fluids from adversely affecting the performanceof electrical contacts, the thermoelectric device and/or any otherelectrical and/or mechanical components. Thus, liquids such as water andantifreeze are compatible with embodiments of the method and apparatusdescribed herein, as are liquid metals (e.g., liquid sodium), slurriesof fluids and solids, other Newtonian or non-Newtonian fluids and/or thelike.

Because the temperature change available from a thermoelectric systemcan be significant, the heat exchanger systems described herein andvariations thereof can be applicable to a wide variety of uses. Themethod and apparatus described herein are generally applicable to anysituation where there is a desire to transfer (e.g., pump) a thermallyconditioned fluid. Such applications include constant temperaturedevices, for example, devices using a reference temperature as in athermocouple assembly. Another exemplary application is as a componentin a constant temperature bath, for example, for laboratory and/orindustrial applications. The method and apparatus described herein areuseful in applications with low flow rates and/or small temperaturechanges, as well as applications with large flow rates and/orsubstantial temperature differences.

By placing a temperature sensor at a predetermined location, whether onthe heat exchanger, upstream or downstream of the heat exchanger and/orelsewhere, and electronically controlling the impeller rotation, acontrolled stream of thermally conditioned fluid can be provided tomaintain the temperature at a predetermined temperature, or to providepredetermined thermal conditions. Thus, some embodiments areparticularly useful where localized thermal control is desired, forexample, in vehicle seats, beds, waterbeds, aquariums, water coolers,cooling of beverages and the like.

In certain embodiments, the thermoelectric device can comprise one ormore sensors. In some embodiments, such sensors, which can be disposedwithin the thermoelectric device or outside the thermoelectric device,can be configured to communicate with one or more of the control devices(not shown) such that the temperature can be used as part of a controlroutine and/or as part of a fail-safe mechanism. In other embodiments,the temperature sensor can be positioned at other positions within theblower/thermoelectric device assembly and/or upstream and/or downstreamof the assembly.

Furthermore, some embodiments find particular application in situationswhere a fluid with different temperatures at different times is desired.In some embodiments, the device is operated as a fan, and thethermoelectric aspect is activated as desired. Thus, some embodimentsprovide warmer, cooler, and/or ambient temperature fluid.

In another embodiment illustrated in cross section in FIG. 18A and inperspective in FIG. 18B, the device 1800 does not comprise a TED, heatexchanger, heater, or other temperature or thermal modifying unit.Instead, the device or system can be configured as a radial outletblower 1800 comprising a housing 1810, an intake 1822, an outlet 1824and a motor-impeller assembly 1830, similar to the correspondingcomponents in the device 100. In the illustrated embodiment, thedirection of the airflow out of the outlet 1824 is generally coaxialwith an axis of symmetry of the device 1800. Such a configuration hasadvantages in applications in which ventilation is distributed over alarge surface, for example, for a seat, a cushion, or a bed, because airdistribution channels 1892 can be fluidly connected around the perimeterof the outlet 1824, as illustrated in FIGS. 18C and 18D in a top viewand a side view of an embodiment of a radial outlet blower 1800 mountedin a seat cushion 1890. Because the airflow is spread out at the bloweroutlet, less pressure is required compared with other blower assembliesdiscussed herein.

In a blower 1900 in which the airflow out of an outlet 1924 is turned(e.g., by 90 degrees or so) using a snout, for example as illustrated inFIG. 19A, one or more distribution channels of a seating assembly, bedor other device are coupled through the snout, resulting in a morecomplicated fluid connection system. Such a system may also exhibitgreater back pressure, for example, as illustrated in FIGS. 19B and 19Cin a top view and a side view of a blower 1900 mounted in a seat cushion1990 and associated distribution channels 1902.

Some embodiments of the radial outlet blower 1800 also exhibit reducednoise compared with other types of blowers. For example, a blower 1900illustrated in FIG. 19A comprises a “cutoff zone” 1980 at the cutoff ofthe scroll. In some arrangements, at such a cutoff zone, a portion ofthe air exits the outlet 1924 and another portion continues to circulatewithin the housing of the blower 1900, which can create noise dependingon the configuration of the scroll, the impeller and the cutoff. Becausethe radial outlet blower 1800 illustrated in FIG. 18A does not comprisea cutoff, the device 1800 does not generate any cutoff noise, resultingin a quieter device. Moreover, noise in a blower is also associated withnon-uniformities in flow, pressure, velocity and/or one or more otherflow characteristics or properties, which result in pressure gradientsaround the circumference of the housing. The symmetry of the radialoutlet blower 1800 can be configured to reduce such non-uniformities,thereby reducing noise at a similar flow rate and backpressure.

Some embodiments of radial outlet blowers 1800 do not generate as high aback pressure at a similar airflow as a blower comprising a scroll,however, and consequently, are not suitable for certain applications inwhich a relatively higher back pressure is desired.

FIG. 20 illustrates a side cross sectional view of an embodiment of aseating system 2000 comprising radial outlet blowers 1800 configured toventilate a seating surface 2010 and a back 2020. The illustratedembodiment comprises optional heating mats 2030 or other heatingelements disposed below seat trim 2040 on both the seat surface 2010 andback 2020.

In any of the embodiments disclosed herein, the integrated blower-TEDdevice can be configured to direct thermally-conditioned air or otherfluid directly to one or more users. For example, such air can bedelivered to a user's neck, shoulders, legs and/or other anatomical areausing a duct or other conduit (e.g., internal channels of a seatingassembly, bed, etc.). In some arrangements, such ducts or conduits arepositioned outside of a seating assembly (e.g., routed along a side of aseat, bed, etc.).

In other embodiments, as illustrated in FIG. 20, one or more mainoutlets of a combined blower-TED device can be configured to be in fluidcommunication with corresponding channels, inlets or other conduitsformed within a cushion, mattress (e.g., core portion, topper portion,etc.) or any other member or component of a seating assembly (e.g.,vehicle seat, bed, etc.). As discussed, this can eliminate the need forseparate conduits or interconnecting duct members, which may beparticularly advantageous in embodiments where space is generallyrelatively limited.

Although several preferred embodiments and certain features aredescribed herein, it will be understood that various omissions,substitutions, combinations, and changes one or more of the details ofthe system, apparatus, and/or method, may be made by those skilled inthe art without departing from the present disclosure. Also, one or morevarious components of one figure and/or embodiment may be used indifferent combinations with components of other figures and/orembodiments to produce specific combinations not illustrated and/ordescribed in any particular figure or embodiment. Consequently, thescope of the disclosure is not limited by the foregoing discussion,which is intended to illustrate.

1. A heat exchange device comprising: a housing, having at least oneinlet, at least one first outlet and at least one second outlet; animpeller positioned within the housing, the impeller configured toreceive fluid from the at least one inlet and transfer it to at leastone of the first outlet and the second outlet; and at least one heatexchange module configured to receive a volume of fluid and selectivelythermally condition said fluid before said fluid exits through the firstoutlet or the second outlet; wherein the heat exchange module ispositioned within the housing.
 2. The device of claim 1, wherein theheat exchange module comprises a thermoelectric device.
 3. The device ofclaim 2, wherein the thermoelectric device comprises a Peltier circuit4. The device of claim 2, wherein the heat exchange module furthercomprises heat exchangers, the heat exchangers being in thermalcommunication with the thermoelectric device, wherein at least a portionof the volume of fluid is directed through or near such heat exchangers.5. The device of claim 4, wherein the heat exchangers are in thermalcommunication with a substrate, the substrate comprising a thermallyconductive and electrically non-conductive material.
 6. The device ofclaim 1, wherein the heat exchange module is positioned along an outerperimeter portion of the interior of the housing.
 7. The device of claim6, wherein the heat exchange module extends along substantially theentire perimeter portion of the housing.
 8. The device of claim 1,wherein the device comprises at least two separate heat exchangemodules.
 9. The device of claim 8, wherein the heat exchange modules aresubstantially equally spaced apart within the interior of the housing.10. The device of claim 8, wherein the heat exchange modules areelectrically connected to each other.
 11. The device of claim 10,wherein the heat exchange modules are electrically connected to eachother using end couplings, said end coupling comprising extensions of asubstrate of a thermoelectric device.
 12. The device of claim 4, whereinthe heat exchange module comprises a set of upper heat exchangers influid communication with an upper side of the thermoelectric device anda set of lower heat exchangers in fluid communication with a lower sideof the thermoelectric device, wherein the at least one first outlet isin fluid communication with the set of upper heat exchangers and the atleast one second outlet is in fluid communication with the set of lowerheat exchangers.
 13. The device of claim 1, wherein the at least firstoutlet is located along a sidewall portion of the housing and whereinthe at least second outlet is located along a bottom portion of thehousing.
 14. The device of claim 1, wherein the impeller is configuredto substantially deliver an equal volume of fluid to the at least firstoutlet and the at least second outlet.
 15. The device of claim 4,wherein the heat exchangers are oriented along a direction thatgenerally coincides with a fluid flow direction approaching said heatexchangers.
 16. The device of claim 1, wherein the device is configuredto supply thermally conditioned fluid to a seat assembly.
 17. The deviceof claim 1, wherein the heat exchange module is configured toaccommodate thermal stresses when in use.
 18. The device of claim 17,wherein a substrate of the heat exchange module comprises at least oneexpansion joint.
 19. A climate controlled seat assembly comprising: aseat bottom portion; a seat back portion; a heat exchange devicecomprising: a housing, having at least one inlet, at least one firstoutlet and at least one second outlet; an impeller positioned within thehousing, the impeller configured to receive fluid from the at least oneinlet and transfer it to at least one of the first outlet and the secondoutlet; and at least one heat exchange module configured to receive avolume of fluid and selectively thermally condition said fluid beforesaid fluid exits through the first outlet or the second outlet; whereinthe heat exchange module is positioned within the housing; whereinthermally conditioned fluid exiting the first outlet or the secondoutlet of the heat exchange device is configured to be delivered withinan opening of at least of the seat bottom portion and the seat backportion; and wherein the thermally conditioned fluid is configured to betransferred toward a occupant of the seat assembly.
 20. The assembly ofclaim 19, wherein the heat exchange device is mounted to a surface ofthe seat back portion or the seat bottom portion.
 21. The assembly ofclaim 19, wherein at least one of the first outlet and the second outletis configured to generally align with and be in fluid communication withthe opening of the seat bottom portion or the seat back portion.
 22. Amethod of thermally conditioning a fluid comprising positioning at leastone heat exchange module within a housing of a blower; wherein the atleast one heat exchange module configured to receive a volume of fluidand selectively thermally condition said fluid before said fluid exitsthrough an outlet of the housing; and selectively heating or coolingsaid fluid by electrically energizing said heat exchange module andactivating an impeller of the blower; wherein the heat exchange modulecomprises a thermoelectric device.